TDK TAS300载入口。

用途：用于半导体制造工艺中，实现300mm硅晶圆在不同装置间的自动传送，是半导体生产流程里重要的物料传输设备。

技术原理：通过优化的机械结构与自动化控制技术，实现晶圆传送盒（FOUP）的精准对接和晶圆的平稳进出。采用防止尘粒产生和进入的设计，保障晶圆在传送过程中的洁净环境。

性能：在装置轻量化方面达到行业较高水准，相比前代产品重量减轻约1/2 。晶圆出入门开关速度相较于旧型号提升约40%，能高效快速地完成晶圆传送操作，有效提高生产效率。

Product Name：TDK TAS300 LoadPort.

Purpose：It is used in the semiconductor manufacturing process to achieve the automatic transfer of 300mm silicon wafers between different devices and is an important material transfer equipment in the semiconductor production process.

Technical Principle：Through optimized mechanical structure and automated control technology, it realizes the precise docking of the wafer transfer box (FOUP) and the smooth entry and exit of wafers. It adopts a design to prevent the generation and entry of dust particles to ensure a clean environment for wafers during the transfer process.

Performance：It has reached a high level in the industry in terms of device lightweighting, with its weight reduced by about 1/2 compared to previous products. The opening and closing speed of the wafer access door has increased by about 40% compared to the old model, which can efficiently and quickly complete wafer transfer operations and effectively improve production efficiency.